发明名称 METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component including an outer electrode having high form accuracy.SOLUTION: An applying process of applying a conductive paste for constituting an outer electrode on an electronic component body 10 is performed. The applying process includes: supplying a conductive paste 25 to a first groove 21a of a first roller 21 in which the first groove 21a is provided on an outer peripheral surface configured by an elastic body along a circumferential direction; arranging the electronic component body 10 such that a first ridge portion 10h configured by a second principal surface 10b and a first end surface 10e of the electronic component body 10 is positioned in the first groove 21a in a planar view while causing the second principal surface 10b to face the outer peripheral surface of the first roller 21; and pressing the electronic component body 10 on the outer peripheral surface of the first roller 21 such that the first ridge portion 10h is positioned in the first groove 21a in a depth direction of the first groove 21a and applying the conductive paste 25 on the electronic component body 10.</p>
申请公布号 JP2015164175(A) 申请公布日期 2015.09.10
申请号 JP20140255818 申请日期 2014.12.18
申请人 MURATA MFG CO LTD 发明人 SAWADA TAKASHI
分类号 H01G4/30;H01G4/12;H01G13/00 主分类号 H01G4/30
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