发明名称 |
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM |
摘要 |
A substrate processing apparatus includes: a process chamber including a source gas supply and a reactive gas supply to process a plurality of substrates in the source gas supply and the reactive gas supply; a substrate placement unit rotating in the process chamber, wherein the plurality of substrates are placed on the substrate placement unit along a rotational direction thereof; a plasma generator to generate plasma in plasma generation chamber installed an upper portion of the reactive gas supply; a coil wound along an outer circumference of the plasma generation chamber, a portion of which adjacent to a sidewall of the plasma generation chamber has a constant curvature; a reactive gas supply system to supply a reactive gas to the reactive gas supply via the plasma generation chamber through a ceiling of the plasma generation chamber; and a source gas supply system to supply a source gas. |
申请公布号 |
US2015252474(A1) |
申请公布日期 |
2015.09.10 |
申请号 |
US201514640589 |
申请日期 |
2015.03.06 |
申请人 |
Hitachi Kokusai Electric Inc. |
发明人 |
ITATANI Hideharu;INADA Tetsuaki;TAKEBAYASHI Motonari;TOYODA Kazuyuki |
分类号 |
C23C16/455;C23C16/458;H01L21/285;C23C16/06;C23C16/22;H01L21/02;C23C16/50;C23C16/52 |
主分类号 |
C23C16/455 |
代理机构 |
|
代理人 |
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主权项 |
1. A substrate processing apparatus comprising:
a process chamber comprising a source gas supply region and a reactive gas supply region and configured to process a plurality of substrates in the source gas supply region and the reactive gas supply region; a substrate placement unit capable of rotating in the process chamber, wherein the plurality of substrates are placed on the substrate placement unit along a rotational direction thereof; a plasma generating unit configured to generate plasma in plasma generation chamber installed at an upper portion of the reactive gas supply region; a coil wound along an outer circumference of the plasma generation chamber, wherein a portion of the coil adjacent to a sidewall of the plasma generation chamber has a constant curvature; a reactive gas supply system configured to supply a reactive gas to the reactive gas supply region via the plasma generation chamber through a ceiling of the plasma generation chamber; and a source gas supply system configured to supply a source gas to the source gas supply region. |
地址 |
Tokyo JP |