| 发明名称 |
BONDING STRUCTURE OF ALUMINUM MEMBER AND COPPER MEMBER |
| 摘要 |
A bonding structure of an aluminum member and a copper member includes: the aluminum member composed of aluminum or an aluminum alloy, and the copper member composed of copper or a copper alloy in which the aluminum member and the copper member are bonded together by solid phase diffusion bonding; an intermetallic compound layer that is made of copper and aluminum and is formed in a bonding interface between the aluminum member and the copper member; and an oxide dispersed in an interface between the copper member and the intermetallic compound layer in a layered form along the interface. |
| 申请公布号 |
US2015251382(A1) |
申请公布日期 |
2015.09.10 |
| 申请号 |
US201314428776 |
申请日期 |
2013.09.18 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
Terasaki Nobuyuki;Nagatomo Yoshiyuki |
| 分类号 |
B32B15/01;B23K20/233;B23K20/02 |
主分类号 |
B32B15/01 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonding structure of an aluminum member and a copper member comprising:
the aluminum member composed of one of aluminum and an aluminum alloy, and the copper member composed of one of copper and a copper alloy, wherein the aluminum member and the copper member are bonded together by solid phase diffusion bonding; an intermetallic compound layer that is made of copper and aluminum and is formed in an bonding interface between the aluminum member and the copper member; and an oxide dispersed in an interface between the copper member and the intermetallic compound layer in a layered form along the interface. |
| 地址 |
Tokyo JP |
