| 发明名称 |
Semiconductor Package and Method |
| 摘要 |
A first package is bonded to a second package with a structural member located between the first package and the second package for structural support. In an embodiment the structural member is a plate or one or more conductive balls. Once the structural member is in place, the first package is bonded to the second package. |
| 申请公布号 |
US2015255431(A1) |
申请公布日期 |
2015.09.10 |
| 申请号 |
US201414276784 |
申请日期 |
2014.05.13 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
Su An-Jhih;Chen Hsien-Wei |
| 分类号 |
H01L25/065;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a first package with a first side; a second package with a second side facing the first side; first external connections electrically connecting the first side of the first package and the second side of the second package; and a structural member between the first package and the second package, wherein the structural member has a different dimension than the first external connections. |
| 地址 |
Hsin-Chu TW |
