BAKING TOOL FOR IMPROVED WAFER COATING PROCESS

摘要

Baking methods and tools for improved wafer coating are described. In one embodiment, a method of dicing a semiconductor wafer including integrated circuits involves coating a surface of the semiconductor wafer to form a mask covering the integrated circuits. The method involves baking the mask with radiation from one or more light sources. The method involves patterning the mask with a laser scribing process to provide a patterned mask with gaps, exposing regions of the substrate between the ICs. The method may also involves singulating the ICs, such as with a plasma etching operation.

主权项

1. A method of dicing a semiconductor wafer comprising integrated circuits (ICs), the method comprising:
coating a surface of the semiconductor wafer to form a mask covering the ICs; baking the mask with radiation from one or more light sources that illuminate an entire upper surface of the mask; and patterning the mask with a laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the ICs.