| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technique that can enhance the extraction performance of electrical parts having flexibility.SOLUTION: Plural projections 16 are formed on the bottom surface 14 of a housing recess portion 12 of an embossment carrier tape 10, and silicone resin is coated on portions other than the apex portions 16a of the projections 16 of the housing recess portion 12 to form a silicone resin layer 18. Accordingly, the contact area between a heat transfer sheet S having an adhesive layer and the bottom surface 14 of the housing recess portion 12 can be reduced, and the fixing between the heat transfer sheet S and the bottom surface 14 of the housing recess portion 12 can be prevented. Even when the heat transfer sheet S sags due to the flexibility thereof and thus comes into contact with the portions other than the apex portions 16a, the strong fixing between the heat transfer sheet S and the bottom surface 14 of the housing recess portion 12 can be prevented by the silicone resin layer 18. As a result, the extraction performance of extracting electronic parts having flexibility can be enhanced.</p> |
