METHOD OF FORMING STACKED WIRING, MANUFACTURING METHOD OF LIQUID EJECTING HEAD, WIRING MOUNTING STRUCTURE, AND LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

摘要

A connection terminal, in which the width of the side opposite to a first adhesion layer is greater than the width of the first adhesion layer in a cross-sectional shape, is formed on the first adhesion layer which is formed on a flow path forming substrate and etched by an etchant, the connection terminal is covered with a second adhesion layer formed from the same material as that of the first adhesion layer, and an inclined wiring is formed on the connection terminal through the wet etching method with the etchant.

主权项

1. A method of forming a stacked wiring comprising:
forming a first wiring, in which a width of the side opposite to a first adhesion layer is greater than a width of the first adhesion layer in a cross-sectional shape, on the first adhesion layer which is formed on a substrate and etched by an etchant; covering the first wiring with a second adhesion layer which is formed from the same material as that of the first adhesion layer; and forming a second wiring on the first wiring via the second adhesion layer through a wet etching method with the etchant.