CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME, AND SOLAR CELL MODULE

摘要

PROBLEM TO BE SOLVED: To provide a circuit board and a solar cell module which have high density and high reliability and which is inexpensive; and require no removal process of an unwanted part at the time of forming a circuit pattern; and reduce defects due to end face burrs of a conductive circuit and peeling of the circuit pattern.SOLUTION: A circuit board includes a base material, an adhesive layer and a metal electrode in this order. The metal electrode is formed by cutting a metal foil and without removing the cut part, and the metal electrode has a cut end face and the cut end face inclines to a normal of the base material.