| 发明名称 |
PACKAGE STRUCTURE |
| 摘要 |
A package structure is disclosed. The package structure includes a first die, a second die on the first die, and a substrate disposed corresponding to the first die. The first die includes a first die identification (ID) region defined thereon and a plurality of first through silicon vias (TSVs) in the first die ID region. The second die includes another first die identification (ID) region and a second die ID region defined thereon and a plurality of second TSVs in the another first die ID region and a plurality of third TSVs in the second die ID region, in which the second TSVs are electrically connected to the first TSVs in the first die. |
| 申请公布号 |
US2015255430(A1) |
申请公布日期 |
2015.09.10 |
| 申请号 |
US201414201934 |
申请日期 |
2014.03.10 |
| 申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
Tang Kuang-Hui |
| 分类号 |
H01L25/065;H01L23/00;H01L23/522 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package structure, comprising:
a first die, comprising a first die identification (ID) region defined thereon and a plurality of first through silicon vias (TSVs) in the first die ID region; a second die on the first die, wherein the second die comprises another first die identification (ID) region and a second die ID region defined thereon and a plurality of second TSVs in the another first die ID region and a plurality of third TSVs in the second die ID region, wherein the second TSVs are electrically connected to the first TSVs in the first die; and a substrate disposed corresponding to the first die. |
| 地址 |
Hsin-Chu City TW |
