发明名称 |
WIRING SUBSTRATE AND METHOD OF MAKING WIRING SUBSTRATE |
摘要 |
A wiring substrate includes a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, the projecting part being situated at a border that divides a plurality of areas in the hole, a plurality of electronic components disposed in the areas, respectively, the electronic components being arranged at a spaced interval with the projecting part therebetween, and a resin layer filling the hole and supporting the electronic components, wherein a thickness of the projecting part in the thickness direction of the core layer decreases toward a tip of the projecting part. |
申请公布号 |
US2015257275(A1) |
申请公布日期 |
2015.09.10 |
申请号 |
US201514634972 |
申请日期 |
2015.03.02 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KUSAMA Yasuhiko;TAKO Hideyuki;KAWAI Kenji;MIYASAKA Fumihisa |
分类号 |
H05K1/18 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
1. A wiring substrate, comprising:
a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, the projecting part being situated at a border that divides a plurality of areas in the hole; a plurality of electronic components disposed in the areas, respectively, the electronic components being arranged at a spaced interval with the projecting part therebetween; and a resin layer filling the hole and supporting the electronic components, wherein a thickness of the projecting part in the thickness direction of the core layer decreases toward a tip of the projecting part. |
地址 |
Nagano JP |