| 发明名称 |
WIRING SUBSTRATE AND METHOD OF MAKING WIRING SUBSTRATE |
| 摘要 |
A wiring substrate includes a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole, a plurality of electronic components disposed in the hole and arranged side by side at a spaced interval in a plan view, the electronic components having side portions thereof, the side portions being engaged with the projecting part, and a resin layer filling the hole and supporting the electronic components. |
| 申请公布号 |
US2015257274(A1) |
申请公布日期 |
2015.09.10 |
| 申请号 |
US201514625809 |
申请日期 |
2015.02.19 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KUSAMA Yasuhiko;TAKO Hideyuki;KAWAI Kenji;MIYASAKA Fumihisa |
| 分类号 |
H05K1/18;H05K3/30;H05K3/00 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring substrate, comprising:
a core layer having a hole penetrating therethrough in a thickness direction thereof, and having a projecting part projecting from an inner wall of the hole toward an inner space of the hole; a plurality of electronic components disposed in the hole and arranged side by side at a spaced interval in a plan view, the electronic components having side portions thereof, the side portions being engaged with the projecting part; and a resin layer filling the hole and supporting the electronic components. |
| 地址 |
Nagano JP |
