| 发明名称 |
SILVER PLATING IN ELECTRONICS MANUFACTURE |
| 摘要 |
Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability. |
| 申请公布号 |
US2015257264(A1) |
申请公布日期 |
2015.09.10 |
| 申请号 |
US201514666990 |
申请日期 |
2015.03.24 |
| 申请人 |
Enthone Inc. |
发明人 |
Yau Yung-Herng;Richardson Thomas B.;Abys Joseph A.;Wengenroth Karl F.;Fiore Anthony;Xu Chen;Fan Chonglun;Fudala John |
| 分类号 |
H05K1/09 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A plating composition for Ag plating a metal surface, the composition comprising a source of Ag ions, water, and a modulating agent, wherein the composition has a pH below about 3 and an ionic content such that the composition has a room temperature conductivity below about 10 mS/cm. |
| 地址 |
West Haven CT US |
