发明名称 WIRE AND SEMICONDUCTOR DEVICE
摘要 A wire of an embodiment includes: a substrate; a metal film provided on the substrate; a metal part provided on the metal film; and graphene wires formed on the metal part, wherein the graphene wire is electrically connected to the metal film, and the metal film and the metal part are formed using different metals or alloys from each other.
申请公布号 US2015255399(A1) 申请公布日期 2015.09.10
申请号 US201514717331 申请日期 2015.05.20
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 YAMAZAKI Yuichi;WADA Makoto;KITAMURA Masayuki;SAKAI Tadashi
分类号 H01L23/532 主分类号 H01L23/532
代理机构 代理人
主权项 1. (canceled)
地址 Minato-ku JP