PACKAGE STRUCTURE

摘要

A package structure includes an insulation layer, a first conductive layer, a second conductive layer, at least one electronic component, and at least one thermal conduction structure. At least one first conductive via and at least one second conductive via are formed in the insulation layer. The first conductive layer is disposed on a top surface of the insulation layer and contacted with said at least one first conductive via. The second conductive layer is disposed on a bottom surface of the insulation layer and contacted with the second conductive via. The electronic component is embedded within the insulation layer, and includes plural conducting terminals. The plural conducting terminal is electrically connected with the first conductive layer and the second conductive layer through said at least one first conductive via and said at least one second conductive via. Said at least one thermal conduction structure is embedded within the insulation layer.

主权项

1. A package structure, comprising:
an insulation layer, wherein at least one first conductive via and at least one second conductive via are formed in the insulation layer; a first conductive layer disposed on a top surface of the insulation layer and contacted with said at least one first conductive via; a second conductive layer disposed on a bottom surface of the insulation layer and contacted with said at least one second conductive via; at least one electronic component embedded within the insulation layer, and comprising plural conducting terminals, wherein the conducting terminal is electrically connected with the first conductive layer and the second conductive layer through said at least one first conductive via and said at least one second conductive via; and at least one thermal conduction structure embedded within the insulation layer, and located at at least one lateral side of said at least one electronic component; wherein the insulation layer has a first side and a second side opposite to the first side, the first side and the second side are between the top surface and the bottom surface, and the at least one thermal conduction structure is partially exposed to the first side or the second side of the insulation layer; wherein said at least one thermal conduction structure is implemented by a metallic lead frame with electrical conduction and thermal conduction properties.