| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that is highly reliable under a high-temperature environment.SOLUTION: A semiconductor device comprises: a semiconductor element; a lead frame joined to the semiconductor element; a joining material for joining the semiconductor element to the lead frame; and a cured sealing resin for sealing the semiconductor element, the joining material, and a part of the lead frame. The joining material contains a silver particle sintered body. The glass transformation temperature of the cured sealing resin is 195°C or more. The cured sealing resin has a coefficient of elasticity of 10 to 20 GPa at 50°C and a coefficient of linear expansion of 9×10to 24×10/°C in a glass region. |
