| 发明名称 |
COMBINED SUBSTRATE |
| 摘要 |
A combined substrate includes a first substrate having multiple first metal posts, a second substrate having multiple second metal posts such that the second metal posts are positioned to oppose the first metal posts, respectively, and multiple solder structures interposed between the first metal posts and the second metal posts, respectively. The first metal posts and/or the second metal posts have recessed surfaces formed such that the solder structures are formed on the recessed surfaces, respectively. |
| 申请公布号 |
US2015255433(A1) |
申请公布日期 |
2015.09.10 |
| 申请号 |
US201514638324 |
申请日期 |
2015.03.04 |
| 申请人 |
IBIDEN CO., LTD. |
发明人 |
DAIZO Tomoya;Adachi Takema;Furusawa Takeshi;Nakamura Wataru;Ito Yuki;Yoshikawa Yuki;Hirabayashi Tomoyoshi |
| 分类号 |
H01L25/065;H01L23/00 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A combined substrate, comprising:
a first substrate having a plurality of first metal posts; a second substrate having a plurality of second metal posts such that the plurality of second metal posts is positioned to oppose the plurality of first metal posts, respectively; and a plurality of solder structures interposed between the plurality of first metal posts and the plurality of second metal posts, respectively, wherein at least one of the plurality of first metal posts and the plurality of second metal posts has a plurality of recessed surfaces configured such that the plurality of solder structures is formed on the plurality of recessed surfaces, respectively. |
| 地址 |
Ogaki JP |
