发明名称 |
METHOD AND APPARATUS FOR ALIGNING NANOWIRES DEPOSITED BY AN ELECTROSPINNING PROCESS |
摘要 |
Embodiments of the invention generally include apparatus and methods for depositing nanowires in a predetermined pattern during an electrospinning process. An apparatus includes a nozzle for containing and ejecting a deposition material, and a voltage source coupled to the nozzle to eject the deposition material. One or more electric field shaping devices are positioned to shape the electric field adjacent to a substrate to control the trajectory of the ejected deposition material. The electric field shaping device converges an electric field at a point near the surface of the substrate to accurately deposit the deposition material on the substrate in a predetermined pattern. The methods include applying a voltage to a nozzle to eject an electrically-charged deposition material towards a substrate, and shaping one or more electric fields to control the trajectory of the electrically-charged deposition material. The deposition material is then deposited on the substrate in a predetermined pattern. |
申请公布号 |
US2015251214(A1) |
申请公布日期 |
2015.09.10 |
申请号 |
US201514716489 |
申请日期 |
2015.05.19 |
申请人 |
Applied Materials, Inc. |
发明人 |
LESCHKIES Kurtis;VERHAVERBEKE Steven;VISSER Robert |
分类号 |
B05D1/00;D01F1/09;D01D11/06;B05B5/04;D01D5/00 |
主分类号 |
B05D1/00 |
代理机构 |
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代理人 |
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主权项 |
1. An apparatus for electrospinning a material on a substrate, comprising:
a reservoir for containing a deposition material; a nozzle in fluid communication with the reservoir, the nozzle adapted to deliver the deposition material to a surface of a substrate; a substrate support movable relative the nozzle, the substrate support adapted to support the substrate adjacent to the nozzle; a voltage source coupled to the nozzle to apply an electric potential to the nozzle to eject the deposition material from the nozzle; and one or more coils positioned around a process region located between the nozzle and the substrate support, the one or more coils adapted to influence the trajectory of the deposition material ejected from the nozzle. |
地址 |
Santa Clara CA US |