发明名称 METHOD AND APPARATUS FOR ALIGNING NANOWIRES DEPOSITED BY AN ELECTROSPINNING PROCESS
摘要 Embodiments of the invention generally include apparatus and methods for depositing nanowires in a predetermined pattern during an electrospinning process. An apparatus includes a nozzle for containing and ejecting a deposition material, and a voltage source coupled to the nozzle to eject the deposition material. One or more electric field shaping devices are positioned to shape the electric field adjacent to a substrate to control the trajectory of the ejected deposition material. The electric field shaping device converges an electric field at a point near the surface of the substrate to accurately deposit the deposition material on the substrate in a predetermined pattern. The methods include applying a voltage to a nozzle to eject an electrically-charged deposition material towards a substrate, and shaping one or more electric fields to control the trajectory of the electrically-charged deposition material. The deposition material is then deposited on the substrate in a predetermined pattern.
申请公布号 US2015251214(A1) 申请公布日期 2015.09.10
申请号 US201514716489 申请日期 2015.05.19
申请人 Applied Materials, Inc. 发明人 LESCHKIES Kurtis;VERHAVERBEKE Steven;VISSER Robert
分类号 B05D1/00;D01F1/09;D01D11/06;B05B5/04;D01D5/00 主分类号 B05D1/00
代理机构 代理人
主权项 1. An apparatus for electrospinning a material on a substrate, comprising: a reservoir for containing a deposition material; a nozzle in fluid communication with the reservoir, the nozzle adapted to deliver the deposition material to a surface of a substrate; a substrate support movable relative the nozzle, the substrate support adapted to support the substrate adjacent to the nozzle; a voltage source coupled to the nozzle to apply an electric potential to the nozzle to eject the deposition material from the nozzle; and one or more coils positioned around a process region located between the nozzle and the substrate support, the one or more coils adapted to influence the trajectory of the deposition material ejected from the nozzle.
地址 Santa Clara CA US
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