METAL FINE PARTICLE DISPERSION, METHOD OF PRODUCING CONDUCTIVE SUBSTRATE AND CONDUCTIVE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a metal fine particle dispersion excellent in dispersibility, a conductive substrate which uses the metal fine particle dispersion and is excellent in conductivity, and a method of producing the conductive substrate.SOLUTION: A metal fine particle dispersion comprises a metal fine particle, a polymer dispersant and a dispersion medium. The average primary particle size of the metal fine particle is 0.001-0.5 μm; the polymer dispersant has a polyether skeleton in the principal chain and at least one side chain; and the content of the polymer dispersant is 0.1-100 pts.mass to 100 pts.mass of the content of the metal fine particle. A method of producing a conductive substrate comprises printing an application liquid containing the metal fine particle dispersion in the form of a pattern to form a printed layer and baking the printed layer to form a pattern-like metal fine particle sintered film. A conductive substrate produced by the production method is also provided.