AMBIENT TEMPERATURE METAL DIRECT BONDING

摘要

PROBLEM TO BE SOLVED: To provide a bonded device structure.SOLUTION: A bonded device structure includes: a first substrate having a first pair of metal bonding pads 12 connecting with a device or a circuit and a first nonmetallic region 11 located adjacent to the metal bonding pads on the first substrate 10; a second substrate having a second pair of metal bonding pads located adjacent to the first pair of metal bonding pads connecting with the device or the circuit and a second nonmetallic region 14 located adjacent to the metal bonding pads 15 on the second substrate 13; and a contact bonded boundary surface between the first and second pairs of metal bonding pads which are formed by contact-bonding the first nonmetallic region to the second nonmetallic region. At least one of the first and second substrates may be elastically deformed.