BONDING SYSTEM AND BONDING METHOD

摘要

Provided is a bonding system, which includes: a processing station in which specified processes are performed on a first substrate and a second substrate; and a carry-in/carry-out station in which the first substrate, the second substrate or a laminated substrate obtained by bonding the first substrate and the second substrate is carried into and out of the processing station. The processing station includes: a first processing apparatus configured to coat the first substrate with the bonding agent using a bonding agent injecting part; a second processing apparatus provided with a bevel cleaning unit for cleaning a bevel portion of the first substrate coated with the bonding agent; and a bonding apparatus configured to bond the first substrate and the second substrate through the bonding agent and a release agent. The first processing apparatus or the second processing apparatus further includes a release agent injection part for injecting the release agent.

主权项

1. A bonding system, comprising:
a processing station in which specified processes are performed on a first substrate and a second substrate; and a carry-in/carry-out station in which the first substrate, the second substrate or a laminated substrate obtained by bonding the first substrate and the second substrate is carried into and out of the processing station, wherein the processing station includes: a first processing apparatus provided with an bonding agent injection part for injecting an bonding agent and configured to coat the first substrate with the bonding agent using the bonding agent injecting part; a second processing apparatus provided with a bevel cleaning unit for cleaning a bevel portion of the first substrate coated with the bonding agent; and a bonding apparatus configured to bond the first substrate and the second substrate through the bonding agent and a release agent which is smaller in bonding force than the bonding agent, wherein the first processing apparatus or the second processing apparatus further includes a release agent injection part for injecting the release agent, and is configured to coat the release agent on the second substrate using the release agent injecting part.