| 发明名称 |
METHOD OF BONDING DISPLAY DEVICE |
| 摘要 |
A method of bonding a display device is disclosed. In one aspect, the method comprises forming a seal portion between a substrate, on which an emission region is foamed, and an encapsulating part mounted facing the substrate, aligning positions of the substrate and the encapsulating part in a chamber, changing a vacuum state of the chamber to an atmospheric pressure state so as apply bonding pressure to the substrate and the encapsulating part, wherein the vacuum state and the atmospheric pressure state have different pressures, and applying energy to the seal portion so as to bond the substrate and the encapsulating part. |
| 申请公布号 |
US2015255758(A1) |
申请公布日期 |
2015.09.10 |
| 申请号 |
US201414493181 |
申请日期 |
2014.09.22 |
| 申请人 |
Samsung Display Co., Ltd. |
发明人 |
Hirai Akira |
| 分类号 |
H01L51/56;H01L51/52 |
主分类号 |
H01L51/56 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of bonding a display device, the method comprising:
forming a seal portion between a substrate, on which an emission region is formed, and an encapsulating part mounted facing the substrate; aligning positions of the substrate and the encapsulating part in a chamber; changing a vacuum state of the chamber to an atmospheric pressure state so as apply bonding pressure to the substrate and the encapsulating part, wherein the vacuum state and the atmospheric pressure state have different pressures; and applying energy to the seal portion so as to bond the substrate and the encapsulating part. |
| 地址 |
Yongin-City KR |
