| 摘要 |
<p>The present invention relates to a method of manufacturing a flexible print circuit board by a blanking method without environment pollution and simplifying a manufacturing process to form a circuit by using the blanking method in manufacturing flexible print circuit board (FPCB). one exemplary embodiment of the present invention includes (a) a step of bonding a carrier film to the upper side of the copper film, forming an adhesive layer on the lower side of the copper film, and temporally bonding a release paper to the lower part of the adhesive layer; (b) a step of removing the unnecessary part of the lower side of the copper film by using a blanking method and forming a circuit; (c) a step of temporally bonding a polyimide film to the lower part after removing the release of the lower part of the circuit, and forming a reference layer circuit; (d) a step of temporally bonding a coverlay and removing the carrier film of the reference layer circuit and so stacking the same; and (e) a step of pressing a stack body.</p> |
