发明名称 Method of cleaning plasma processing apparatus
摘要 <p>There is provided a cleaning method for removing a first deposit, formed on an upper electrode through an etching of a metal layer containing a metal, by using a plasma generated between a lower electrode of a lower structure and the upper electrode in a processing chamber of a plasma processing apparatus. The method includes a step of colliding ions with the first deposit formed on the upper electrode and a step of removing a second deposit, which is generated by said colliding and formed on the lower structure. Further, a cycle including the step of colliding and the step of removing is repeated multiple times.</p>
申请公布号 EP2916344(A1) 申请公布日期 2015.09.09
申请号 EP20150157130 申请日期 2015.03.02
申请人 TOKYO ELECTRON LIMITED 发明人 KISHI, HIROKI;HASHIMOTO, MITSURU;SHIMODA, KEIICHI;NISHIMURA, EIICHI;SHIMIZU, AKITAKA
分类号 H01J37/32;C23C16/44 主分类号 H01J37/32
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