| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package for an electronic component which allows for irregularity of a connection surface, particulate contamination, substrate warp, and the like by using a metallic glass thin film, thus permitting connection between substrates, and a method of manufacturing the same. <P>SOLUTION: In the package for an electronic component which includes a first substrate 2 and a second substrate 4, and is configured to mount the electronic component 8 on at least one of the first substrate 2 and the second substrate 4, and allows the first substrate 2 and the second substrate 4 to be connected to each other via a seal part 6 so as to encase the electronic component 8, the seal part 6 is composed of a metallic glass thin film. For example, the first substrate 2 is a COSLSI composed of an Si substrate, and an MEMS is formed on the second substrate 4. Hermetic sealing and electrical connection of the seal part 6 become possible by using plastic deformation of the metallic glass thin film, without restrictions, such as irregularity and warp of the substrates, and particulate contamination. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
