发明名称 |
Semiconductor device having a transparent window for passing radiation |
摘要 |
Method of encapsulating a semiconductor structure (1) comprising providing (301) a semiconductor structure (1) comprising an opto-electric element (2) located in a cavity (3) formed between a substrate (4) and a cap layer (5), the cap layer being made of a material transparent to light, and having a flat upper surface; forming at least one protrusion (7) on the cap layer (5); bringing (303) the at least one protrusion (7) of the cap layer in contact with a tool (8) having a flat surface region, and applying a non-transparent material (9) to the semiconductor structure (1) where it is not in contact with the tool (8); and removing (304) the tool thereby providing an encapsulated optical semiconductor device (10) having a transparent window (11) integrally formed with the cap layer (5). |
申请公布号 |
EP2916357(A1) |
申请公布日期 |
2015.09.09 |
申请号 |
EP20150157383 |
申请日期 |
2015.03.03 |
申请人 |
MELEXIS TECHNOLOGIES NV |
发明人 |
VAN BUGGENHOUT, CARL;CHEN, JIAN |
分类号 |
H01L27/146;H01L31/0203;H01L31/0216 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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