发明名称 真空蒸着装置
摘要 <p>[Problem] To configure a vacuum deposition device so that non-uniformity of a deposited film formed on a body is less likely to occur when multiple evaporation sources are used, and a deposited film with a desired film thickness can be formed. [Solution] The vacuum deposition device (1) is provided with: multiple evaporation sources (3); and a cylindrical body (4) that surrounds the space between the evaporation sources (3) and a body (2) onto which a film is to be deposited, and has an aperture plane (41) on the side facing the body (2) onto which a film is to be deposited. Also, the vacuum deposition device has a partitioning plate (7) that is provided inside the cylindrical body (4). The partitioning plate (7) has aperture sections (70). One or more aperture sections (70) are provided within the range of a circumference having a diameter of D around the center of gravity (P). The diameter (D) is 2/3 of the maximum value of the distance between two points on the outer circumference of the partitioning plate (7). This configuration can achieve a uniform flux distribution for an evaporation material from the aperture sections (70) of the partitioning plate (7) to the body (2) onto which a film is to be deposited. Thus, non-uniformity of the deposited film formed on the body (2) is less likely to occur when multiple evaporation sources (3) are used, and a deposited film with a desired film thickness can be formed.</p>
申请公布号 JP5775579(B2) 申请公布日期 2015.09.09
申请号 JP20130522480 申请日期 2012.07.06
申请人 发明人
分类号 C23C14/24 主分类号 C23C14/24
代理机构 代理人
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