发明名称 Agボンディングワイヤおよびその製造方法
摘要 PROBLEM TO BE SOLVED: To provide an Ag bonding wire for LED package which allows the formation of a spherical ball in nitrogen gas without significantly deteriorating the electrical specific resistance of Ag having high electrical conductivity, the increase in brightness of an LED package, and the achievement of high fatigue resistance in a heat cycle.SOLUTION: The Ag bonding wire for LED package comprises 1.0-3.0 mass% of Au, 0.05-1.0 mass% of Pd, 1-8 mass ppm of Be, 1-20 mass ppm of Ca, and a total of 1-20 mass ppm of Ce and/or La with the balance consisting of Ag and inevitable impurities. The Ag bonding wire has, on its surface, no oxide inclusion of 0.1 μm or larger.
申请公布号 JP5775015(B2) 申请公布日期 2015.09.09
申请号 JP20120053789 申请日期 2012.03.09
申请人 タツタ電線株式会社 发明人 富樫 亮;山方 俊幸
分类号 H01L33/62;H01L21/60 主分类号 H01L33/62
代理机构 代理人
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