| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a white curable material for a semiconductor device excellent in handleability, filling property in a mold and continuous moldability during molding. <P>SOLUTION: The white curable material for a semiconductor device is a white curable composition or a heat treated object obtained by heat treating the white curable composition. The white curable composition comprises an epoxy compound, a curing agent, titanium oxide, a filler different from titanium oxide, and a curing accelerator. The white curable material for an optical semiconductor device has a softening point of 60 to <120°C, a viscosity at 170°C of >120 to 300 Pa s, and a gel time at 170°C of 30-100 s. When the white curable material is transfer molded with a mold under the conditions of a molding temperature of 170°C and a molding time of 100 s and the resulting molded body is taken out of the mold, a Shore D hardness of the molded body after the lapse of 5 s after being taken out of the mold is ≥70. <P>COPYRIGHT: (C)2013,JPO&INPIT |
