发明名称 |
PRINTED CIRCUIT BOARD |
摘要 |
A printed wiring board (10) includes: an inner layer structure body (20) containing at least an inner layer insulative base material (31) composed of a glass cloth (31a) and resin (31b) which covers the glass cloth (31a) and not containing a resin insulative base material composed only of resin; outer layer wiring (21) formed on a first face (20a) of the inner layer structure body (20); and a solder resist layer (23) formed on a surface of the outer layer wiring (21), wherein in the inner layer structure body (20), an opening part (11) is formed, and the solder resist layer (23) is composed of a first ink part (23a) covering at least the outer layer wiring (21) that is formed on a partial region of the first face (20a) which corresponds to the opening part (11) and a second ink part (23b) interposing both ends of the first ink part (23a) and being lower in flexibility than the first ink part (23a). |
申请公布号 |
EP2916629(A1) |
申请公布日期 |
2015.09.09 |
申请号 |
EP20140854898 |
申请日期 |
2014.01.14 |
申请人 |
MEIKO ELECTRONICS CO., LTD. |
发明人 |
ISHIKAWA, AKIHIRO;YAMAMOTO,TORU;INOKUCHI, KAZUYA |
分类号 |
H05K3/28;H05K1/02;H05K3/46 |
主分类号 |
H05K3/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|