发明名称 半導体集積回路装置
摘要 <p>Disclosed here is a semiconductor integrated circuit device configured to suppress a voltage drop over the route for transmitting voltages from a power cut-off switch to a power cut-off region without lowering the degree of freedom in routing signal wires in that region. The semiconductor integrated circuit device includes a semiconductor chip in which the power cut-off switch and power cut-off region are provided. A reduction in the number of wiring channels in the power-cut off region is avoided by locating the power cut-off switch outside the power cut-off region. Over the substrate, a substrate-side feed line is formed to transmit a power-supply voltage from the semiconductor chip to outside thereof via the power cut-off switch, before introducing the voltage again into the chip to feed the power cut-off region, thus suppressing the voltage drop between the power cut-off switch and the power cut-off region.</p>
申请公布号 JP5774922(B2) 申请公布日期 2015.09.09
申请号 JP20110147132 申请日期 2011.07.01
申请人 发明人
分类号 H01L21/822;H01L21/82;H01L23/12;H01L27/04 主分类号 H01L21/822
代理机构 代理人
主权项
地址