发明名称 |
METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH HOLE FILLED WITH CONDUCTIVE MATERIAL |
摘要 |
<p>Disclosed is a method for manufacturing an electroconductive material-filled throughhole substrate that is free from any void part in the electroconductive material filled into the throughholes. The method comprises forming an electroconductive base layer on one side of a core substrate having throughholes, and precipitating and growing an electroconductive material from one direction within the throughholes by electroplating using the electroconductive base layer as a seed layer to fill the electroconductive material into the throughholes without forming any void part and thus to manufacture an electroconductive material-filled throughhole substrate.</p> |
申请公布号 |
EP1830614(B1) |
申请公布日期 |
2015.09.09 |
申请号 |
EP20050806324 |
申请日期 |
2005.11.14 |
申请人 |
DAI NIPPON PRINTING CO., LTD. |
发明人 |
CHUJO, SHIGEKI;NAKAYAMA, KOICHI |
分类号 |
H01L21/48;H05K1/03;H05K3/42 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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