发明名称 Nonvolatile memory device and method of fabricating the same
摘要 This technology relates to a nonvolatile memory device and a method of fabricating the same. The nonvolatile memory device may include a pipe connection gate electrode configured to have a bottom buried in a groove formed in a substrate, one or more pipe channel layers formed within the pipe connection gate electrode, pairs of main channel layers each coupled to the pipe channel layer and extended in a direction substantially perpendicular to the substrate, and a plurality of interlayer insulating layers and a plurality of cell gate electrodes alternately stacked along the main channel layers, wherein the pipe connection gate electrode includes a metal silicide layer formed within the groove. The electric resistance of the pipe connection gate electrode may be greatly reduced without an increase in a substantial height by forming the metal silicide layer buried in the substrate under the pipe connection gate electrode.
申请公布号 US9130053(B2) 申请公布日期 2015.09.08
申请号 US201213718388 申请日期 2012.12.18
申请人 SK Hynix Inc. 发明人 Kim Min-Soo;Lee Young-Jin;Choi Jin-Hae;Han Joo-Hee;Whang Sung-Jin;Lee Byung-Ho
分类号 H01L29/792;H01L29/66;H01L27/115 主分类号 H01L29/792
代理机构 IP & T Group LLP 代理人 IP & T Group LLP
主权项 1. A nonvolatile memory device, comprising: a pipe connection gate electrode having a bottom in a groove buried in a substrate; one or more pipe channel layers formed within the pipe connection gate electrode; pairs of main channel layers each coupled to the pipe channel layer and extended in a direction substantially perpendicular to the substrate; and a plurality of interlayer insulating layers and a plurality of cell gate electrodes alternately stacked along the main channel layers, wherein the pipe connection gate electrode comprises a metal silicide layer formed within the groove, wherein the nonvolatile memory device includes a three-dimensional (3-D) structure, wherein the pipe connection gate electrode comprises a second conductive layer for a gate electrode configured to be in contact with a top of the pipe channel layer, wherein the pipe connection gate electrode comprises the metal silicide layer over the substrate, a first conductive layer over the metal silicide layer, and the second conductive layer over the first conductive layer.
地址 Gyeonggi-do KR