Barrier layers for silver reflective coatings and HPC workflows for rapid screening of materials for such barrier layers

摘要

Provided is High Productivity Combinatorial (HPC) testing methodology of semiconductor substrates, each including multiple site isolated regions. The site isolated regions are used for testing different compositions and/or structures of barrier layers disposed over silver reflectors. The tested barrier layers may include all or at least two of nickel, chromium, titanium, and aluminum. In some embodiments, the barrier layers include oxygen. This combination allows using relative thin barrier layers (e.g., 5-30 Angstroms thick) that have high transparency yet provide sufficient protection to the silver reflector. The amount of nickel in a barrier layer may be 5-10% by weight, chromium—25-30%, titanium and aluminum—30%-35% each. The barrier layer may be co-sputtered in a reactive or inert-environment using one or more targets that include all four metals. An article may include multiple silver reflectors, each having its own barrier layer.

主权项

1. A method for forming an article, the method comprising:
providing a substrate; forming a reflective layer above the substrate; and forming a barrier layer above the reflective layer, the barrier layer comprising nickel, chromium, titanium, and aluminum, wherein a concentration of nickel in the barrier layer is between 5% by weight and 10% by weight, a concentration of chromium in the barrier layer is between 25% by weight and 30% by weight, a concentration of titanium in the barrier layer is between 30% by weight and 35% by weight, and a concentration of aluminum in the barrier layer is between 30% by weight and 35% by weight.