发明名称 |
Roll mold, method for fabricating the same and method for fabricating thin film pattern using the same |
摘要 |
Discussed are a roll mold, a method for fabricating the same and a method for fabricating a thin film pattern using the same, to prevent dimensional variation of the mold and simplify the overall process. The method for fabricating a roll mold includes providing a substrate provided with a master pattern layer, sequentially forming a mold surface layer and a solid suffer layer on the substrate provided with the master pattern layer to provide a flat panel mold, forming an adhesive resin layer on the base roller aligned on the flat panel mold, and rolling the base roller provided with the adhesive resin layer over the flat panel mold to adhere the flat panel mold to the base roller through the adhesive resin layer. |
申请公布号 |
US9126356(B2) |
申请公布日期 |
2015.09.08 |
申请号 |
US201113204265 |
申请日期 |
2011.08.05 |
申请人 |
LG DISPLAY CO., LTD. |
发明人 |
Lee Nam-Seok;Kim Chul-Ho;Lee Shin-Bok |
分类号 |
B29C33/40;B29C33/38;B29C33/42;B29C35/08 |
主分类号 |
B29C33/40 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. A method for fabricating a roll mold, comprising:
providing a substrate provided with a master pattern layer; sequentially forming a mold surface layer and a solid buffer layer on the substrate provided with the master pattern layer to provide a flat panel mold; forming an adhesive resin layer on a base roller aligned on the flat panel mold; and rolling the base roller provided with the adhesive resin layer over the flat panel mold to adhere the flat panel mold to the base roller through the adhesive resin layer, wherein the providing of the flat panel mold comprises: forming the mold surface layer on the master pattern layer; forming the buffer layer on the mold surface layer, while one end of the buffer layer is adhered to an unwinder and the other end of the buffer layer is adhered to a rewinder, and keeping the buffer layer level; and cutting the buffer layer to a size of the mold surface layer, wherein the mold surface layer and the adhesive resin layer are cured through light emitted from a light source arranged in the base roller. |
地址 |
Seoul KR |