发明名称 PREPARATION METHOD OF FIN STRUCTURE WITH HEAT-CONDUCTIVE ADHESIVE COMPOSITION
摘要 A fin structure for a heat exchanger includes: a tube-shaped main body in which a thermal media is transferred inside; and multiple heat transferring plates which are combined separately at regular intervals in the circumferential direction on the outer peripheral surface of the main body, wherein the adjacent heat transferring plates are soldered to be interconnected from each other, and the heat transferring plates are integrally combined to the main body. In addition, the heat transferring plates comprise: a heat-conductive hollow particle body which improves heat transfer efficiency; and a heat-conductive adhesive composition including an acrylic polymer, thereby having higher heat transfer efficiency.
申请公布号 KR101551366(B1) 申请公布日期 2015.09.08
申请号 KR20150056580 申请日期 2015.04.22
申请人 SHIN, DONG HUN 发明人 SHIN, DONG HUN
分类号 C09J9/00;C09J11/04;C09J133/06 主分类号 C09J9/00
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