| 主权项 |
1. A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices, said assembly comprising:
a housing configured to define an inlet, an outlet, and a cavity configured to contain coolant within the cavity between the inlet and the outlet; an electronic device located within the cavity, wherein said electronic device is characterized as being substantially planar in shape and thereby defines a first planar side, a second planar side opposite the first planar side, and a device perimeter between the first planar side and the second planar side; a lead frame electrically coupled to the electronic device and extending outside the cavity through an opening in the housing; a first dielectric plate that defines a first inner surface attached to the first planar side and a first outer surface opposite the first inner surface, wherein the first outer surface is metalized, said first dielectric plate having a first plate perimeter that extends beyond at least a portion of the device perimeter; a second dielectric plate that defines a second inner surface attached to the second planar side and a second outer surface opposite the first inner surface, wherein the second outer surface is metalized, said second dielectric plate having a second plate perimeter that extends beyond at least a corresponding portion of the device perimeter; and a sleeve formed of metallic foil and configured to wrap around a portion of the first plate perimeter and a corresponding portion of the second plate perimeter, said sleeve further configured to be attached to the first outer surface and the second outer surface in a manner effective to form a seal and thereby isolate the electronic device from the coolant, wherein the first dielectric plate, the second dielectric plate, and the sleeve cooperate to form a device package. |
