| 发明名称 | Wire and semiconductor device | ||
| 摘要 | A wire of an embodiment includes: a substrate; a metal film provided on the substrate; a metal part provided on the metal film; and graphene wires formed on the metal part, wherein the graphene wire is electrically connected to the metal film, and the metal film and the metal part are formed using different metals or alloys from each other. | ||
| 申请公布号 | US9131611(B2) | 申请公布日期 | 2015.09.08 |
| 申请号 | US201213684297 | 申请日期 | 2012.11.23 |
| 申请人 | Kabushiki Kaisha Toshiba | 发明人 | Yamazaki Yuichi;Wada Makoto;Kitamura Masayuki;Sakai Tadashi |
| 分类号 | H01L23/48;H05K1/09;H01L23/532;B82Y10/00;B82Y99/00;B82Y30/00 | 主分类号 | H01L23/48 |
| 代理机构 | Oblon, McClelland, Maier & Neustadt, L.L.P. | 代理人 | Oblon, McClelland, Maier & Neustadt, L.L.P. |
| 主权项 | 1. A wire comprising: a substrate; a metal film provided on the substrate; a metal part provided on the metal film; and graphene wires formed on the metal part, wherein the graphene wires are electrically connected to the metal film, the metal film and the metal part are formed using different metals or alloys from each other, and the graphene wires include a facet of the metal part, and the facet includes either a (110) plane or a (100) plane. | ||
| 地址 | Tokyo JP | ||