| 发明名称 | Printed circuit board for mobile platforms | ||
| 摘要 | The invention provides a printed circuit board for mobile platforms. An exemplary embodiment of the printed circuit board for mobile platforms includes a core substrate having a first side. A ground plane covers the first side. A first insulating layer covers the ground plane. A plurality of first signal traces and a plurality of first ground traces are alternatively arranged on the first insulating layer. A second insulating layer connects to the first insulating layer. A plurality of second signal traces separated from each other is disposed on the second insulating layer, wherein the second signal traces are disposed directly on spaces between the first signal traces and the first ground traces adjacent thereto. | ||
| 申请公布号 | US9131602(B2) | 申请公布日期 | 2015.09.08 |
| 申请号 | US201313747738 | 申请日期 | 2013.01.23 |
| 申请人 | MEDIATEK INC. | 发明人 | Chang Sheng-Ming;Lin Shih-Chieh;Chen Nan-Cheng |
| 分类号 | H05K1/02;H05K1/11 | 主分类号 | H05K1/02 |
| 代理机构 | McClure, Qualey & Rodack, LLP | 代理人 | McClure, Qualey & Rodack, LLP |
| 主权项 | 1. A printed circuit board for mobile platforms, comprising: a core substrate having a first side; a ground plane fully covering on the first side; a first insulating layer covering the ground plane; a plurality of first signal traces and a plurality of first ground traces, alternatively arranged on the first insulating layer; a second insulating layer connecting to the first insulating layer; and a plurality of second signal traces separated from each other, disposed on the second insulating layer, wherein the second signal traces are disposed directly on spaces between the first signal traces and the first ground traces adjacent thereto. | ||
| 地址 | Hsin-Chu TW | ||