发明名称 |
Modified polystyrene resin particles and manufacturing method therefor, expandable particles and manufacturing method therefor, pre-expanded particles, and expanded molded article |
摘要 |
Modified polystyrene-based resin particles comprising polyacrylic acid ester-based resin microparticles having an average particle diameter in the range of from 30 to 1,000 nm being dispersed in polystyrene-based resin particles, such that the polyacrylic acid ester-based resin microparticles are present (1) in the area ratio of from 0.1 to 15% in a surface area, which includes areas up to 20 μm from the surface of each resin particle, and (2) present in the area ratio of from 11 to 50% in the inner area, which includes the area between the center of each resin particle and an point 30% of the radius from the center of each particle. |
申请公布号 |
US9127148(B2) |
申请公布日期 |
2015.09.08 |
申请号 |
US201113876239 |
申请日期 |
2011.09.30 |
申请人 |
SEKISUI PLASTICS CO., LTD. |
发明人 |
Tsutsui Yasutaka;Terasaki Shingo |
分类号 |
C08L25/06;C08L33/08;C08F2/44;C08F257/02;C08J9/16 |
主分类号 |
C08L25/06 |
代理机构 |
Greenblum & Bernstein, P.L.C. |
代理人 |
Greenblum & Bernstein, P.L.C. |
主权项 |
1. Modified polystyrene-based resin particles comprising polyacrylic acid ester-based resin microparticles having an average particle diameter in the range of from 30 to 1,000 nm being dispersed therein, wherein said polyacrylic acid ester-based resin microparticles
(1) are present in an area ratio of from 0.1 to 15% in a surface region, which includes depths up to 20 um from the surface of each resin particle, and (2) are present in an area ratio of from 11 to 50% in an inner region, which includes depths between the center of each resin particle and a depth 30% of the radius from the center of each resin particle; wherein the modified polystyrene-based resin particles have an average particle diameter in the range of from 0.3 to 2 mm; and wherein the modified polystyrene-based resin particles contain a component derived from acrylate-terminated polybutadiene. |
地址 |
Osaka JP |