发明名称 |
Semiconductor light emitting device |
摘要 |
A semiconductor light emitting device may include an n-type semiconductor layer, an active layer and a p-type semiconductor layer disposed in a first region corresponding to a portion of an upper surface of the n-type semiconductor layer, an n-type electrode formed in a second region distinct from the first region on the n-type semiconductor layer to be electrically connected to the n-type semiconductor layer and including an n-type electrode pad and first and second n-type electrode fingers, and a p-type electrode formed on the p-type semiconductor layer to be electrically connected to the p-type semiconductor layer and including a p-type electrode pad and a p-type electrode finger. A distance between n-type and p-type electrodes may be constant to significantly reduce a phenomenon of concentration of a current in a specific region of an electrode. |
申请公布号 |
US9130125(B2) |
申请公布日期 |
2015.09.08 |
申请号 |
US201114237461 |
申请日期 |
2011.08.17 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Hwang Seok Min;Ha Hae Soo;Kim Jae Yoon;Han Jae Ho |
分类号 |
H01L33/38;H01L33/20 |
主分类号 |
H01L33/38 |
代理机构 |
Harness, Dickey & Pierce, P.L.C. |
代理人 |
Harness, Dickey & Pierce, P.L.C. |
主权项 |
1. A semiconductor light emitting device comprising:
an n-type semiconductor layer; an active layer and a p-type semiconductor layer disposed in a first region corresponding to a portion of an upper surface of the n-type semiconductor layer; an n-type electrode disposed in a second region distinct from the first region on the n-type semiconductor layer to be electrically connected to the n-type semiconductor layer and including an n-type electrode pad and first and second n-type electrode fingers; and a p-type electrode disposed on the p-type semiconductor layer to be electrically connected to the p-type semiconductor layer and including a p-type electrode pad and a p-type electrode finger, wherein the n-type semiconductor layer, the active layer and the p-type semiconductor layer configure a light emitting structure, the n-type electrode pad is disposed inside of a light emission surface provided when the light emitting structure is viewed from above the p-type semiconductor layer, and the p-type electrode pad is disposed adjacent to an edge of the light emission surface, the first n-type electrode finger has a form in which the first n-type electrode finger is extended from the n-type electrode pad to an edge of the light emission surface, opposing an edge on which the p-type electrode pad is located, to then branch in two directions along edges of the light emission surface, and the second n-type electrode finger has a form in which the second n-type electrode finger is extended from the n-type electrode pad in two different directions and the portions thereof extended in two directions are then respectively bent toward the edge of the light emission surface on which the p-type electrode pad is located, and the p-type electrode finger has a form in which the p-type electrode finger is extended from the p-type electrode pad to branch in two directions, along edges of the light emission surface and bypasses a position in which the n-type electrode pad is located, and is then bent toward a portion of the first n-type electrode finger extended from the n-type electrode pad to an edge of the light emission surface. |
地址 |
Gyeonggi-Do KR |