Microelectronic devices and microelectronic support devices, and associated assemblies and methods

摘要

Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.

主权项

1. A microelectronic support device, comprising:
a support member having a first side, a second side, and a passageway extending through the support member between a first aperture in the first side and a second aperture in the second side; a support contact having a first surface and a second surface, the support contact being carried by the second side and being positioned to cover at least a portion of the second aperture, at least a portion of the first surface of the support contact being positioned to be accessible through the first aperture and the passageway; and a bond wire connected to the first surface of the support contact, the bond wire having a portion extending through the first aperture.