Method and structure for integrating capacitor-less memory cell with logic

摘要

Methods for fabricating integrated circuits include fabricating a logic device on a substrate, forming an intermediate semiconductor substrate on a surface of the logic device, and fabricating a capacitor-less memory cell on the intermediate semiconductor substrate. Integrated circuits with capacitor-less memory cells formed on a surface of a logic device are also disclosed, as are multi-core microprocessors including such integrated circuits.

主权项

1. A method for fabricating an integrated circuit, comprising:
fabricating a wafer to comprise logic circuitry devices, the fabricated wafer having an outer surface; disposing a semiconductor material onto the outer surface of the wafer elevationally outward of the logic circuitry devices; and fabricating at least one capacitor-less memory cell on the semiconductor material elevationally outward of the logic circuitry devices after disposing the semiconductor material onto the outer surface of the wafer elevationally outward of the logic circuitry devices.