Submount for LED device package

摘要

A light emitting diode (LED) assembly may include an LED semiconductor attached to a first surface of a submount made of optically transparent material. The submount may redirect back side light emitted by the LED semiconductor light away from the LED semiconductor to increase recovery of back side light. The submount may be used with an external bulk reflecting element. The submount may itself include a reflective coating at a second surface opposite from the first surface and be mounted on a reflecting substrate. The submount may include a phosphor forming the first surface or the second surface. The first surface or the second surface may be a textured surface. An array of LED semiconductors may be mounted to the submount. The array of LED semiconductors may be disposed on the submount in an arrangement that optimizes total light output of the LED assembly.

主权项

1. A method of assembling a light emitting diode (LED) assembly, the method comprising:
preparing a first LED semiconductor comprising a p-type semiconductor, an n-type semiconductor and an active region between the p-type semiconductor and the n-type semiconductor; forming a transparent contact layer on one of the p-type semiconductor and the n-type semiconductor; preparing a submount including a first surface and a second surface opposite the first surface, the submount comprising an optically transparent material; forming a phosphor layer on the first surface of the submount; forming a reflective coating layer on the second surface of the submount; mounting the first LED semiconductor to the first surface of the submount with the transparent contact layer and the phosphor layer therebetween, thereby providing light generated at the active region with an optical path to the submount at the first surface of the submount, wherein the reflective coating layer reflecting the light following the optical path and passing through the submount.