Method for embedding thin film sensor in a material

摘要

An embedded sensor or other desired device is provided within a completed structure through a solid-state bonding process or through a dynamic bonding process. The embedded sensor or other desired device is provided on a substrate through any known or later-developed method. A cover is then bonded to the substrate using a solid-state bonding process or a dynamic bonding process. The solid-state bonding process may include providing heat and pressure to the substrate and the cover to bond the substrate and the cover together. The dynamic bonding process may include heating a bonding agent and distributing the heated bonding agent between the substrate and cover to bond the substrate and the cover together.

主权项

1. A method for forming a thin film sensor embedded in a material, the method comprising:
forming a thin film sensor on or over a surface of a substrate, and bonding a cover to the surface of the substrate using a solid-state bonding process or a dynamic bonding process to provide the thin film sensor embedded in the material, wherein the material comprises the substrate and the cover, and further wherein the substrate, the cover, or both is sapphire, further comprising forming the embedded sensor into a cutting tool adapted for hard machining, dry machining, friction stir welding, or combinations thereof.