发明名称 System and method for provision of infrared signalling in smart phone devices
摘要 A smart phone device is fitted with a dual mode communications interface device having a housing wherein the housing provides access via an exterior of the smart phone device to both an infrared communications pathway and an electrical communications pathway each of which are coupled to one or more processing devices carried within the smart phone device. To this end, the communications interface device may be in the form of an audio jack having a plug receiving opening wherein the plug receiving opening is in communication with the electrical communications pathway and wherein at least a portion of the housing surrounding the plug receiving opening forms a light pipe for the infrared communications pathway.
申请公布号 US9131043(B2) 申请公布日期 2015.09.08
申请号 US201414188866 申请日期 2014.02.25
申请人 UNIVERSAL ELECTRONICS INC. 发明人 Hilbrink Marcel;Hayes Patrick H.
分类号 H04M1/737;H04M1/215;H04M1/725;H04M1/02;H04M1/60 主分类号 H04M1/737
代理机构 Greenberg Traurig, LLP 代理人 Greenberg Traurig, LLP
主权项 1. A portable electronic device, comprising: a device housing having a first opening and a second opening; a processing device carried within the device housing; a wired communications module coupled to the processing device, the wired communications module terminating in a wired communications interface that is disposed in the first opening of the device housing; an infrared communications module coupled to the processing device, the infrared communications module terminating in an infrared emitter; and a user activatable input element comprised of a switch housing and an electro-mechanical switching element, wherein the switch housing is disposed within the second opening of the device housing, the electro-mechanical switch element is carried by the switch housing so as to be accessible from an the exterior of the device housing, and the infrared emitter of the infrared communications module is coupled to an exterior surface of the switch housing that is interiorly located within the device housing.
地址 Santa Ana CA US