Light sensor and manufacturing method thereof

摘要

A light sensor and a manufacturing method thereof are disclosed. The light sensor is capable of being coupled to a carry object and includes a sensing chip and a plurality of conductive connecting elements. The sensing chip includes a first surface and a second surface opposite to each other. The sensing chip also includes a sensing unit disposed between the first surface and the second surface and at least partially exposed by a window formed on the second surface. The first surface faces the carry object when the light sensor is coupled to a carry object. The conductive connecting elements are disposed on the first surface and coupled to the sensing unit in order to couple the light sensor to the carry object.

主权项

1. A light sensor capable of being coupled to a carry object, comprising:
a sensing chip, including:
a first surface, wherein the first surface faces the carry object when the light sensor is coupled to the carry object;a second surface, wherein the second surface is opposite to the first surface and has a window; anda sensing unit disposed between the first surface and the second surface and at least partially exposed by the window;a substrate having the first surface and a supporting surface opposite to each other, wherein the sensing unit is disposed on the supporting surface; anda cover covering the supporting surface and having a window at least partially exposing the sensing unit; a plurality of conductive connecting elements disposed on the first surface and coupled to the sensing unit in order to couple the light sensor to the carry object.