发明名称 Bolometer having absorber with pillar structure for thermal shorting
摘要 A semiconductor device includes a substrate having an electrode structure. An absorber structure is suspended over the electrode structure and spaced a first distance apart from the first electrode structure. The absorber structure includes i) suspension structures extending upwardly from the substrate and being electrically connected to readout conductors, and ii) a pillar structure extending downwardly from the absorber structure toward the first electrode structure. The pillar structure has a contact portion located a second distance apart from the first electrode structure, the second distance being less than the first distance. The absorber structure is configured to flex toward the substrate under a test condition. The second distance is selected such that the contact portion of the pillar structure is positioned in contact with the first electrode structure when the absorber structure is flexed in response to the test condition.
申请公布号 US9130081(B2) 申请公布日期 2015.09.08
申请号 US201314109936 申请日期 2013.12.17
申请人 Robert Bosch GmbH 发明人 Yama Gary;Purkl Fabian;Feyh Ando Lars
分类号 G01J5/20;H01L31/0248;H01L31/18;G01J5/02;H01L31/09 主分类号 G01J5/20
代理机构 Maginot Moore & Beck LLP 代理人 Maginot Moore & Beck LLP
主权项 1. A semiconductor device comprising: a substrate having an upper surface that defines a sensing region; a patterned conductive layer provided on the upper surface, the patterned conductive layer including a first electrode structure located in the sensing region and readout conductors located around the sensing region; an absorber structure suspended over the sensing region and spaced a first distance apart from the first electrode structure, the absorber structure including i) suspension structures extending upwardly from the substrate and being electrically connected to the readout conductors, and ii) a pillar structure extending downwardly from the absorber structure toward the first electrode structure, the pillar structure having a contact portion located a second distance apart from the first electrode structure, the second distance being less than the first distance; and test circuitry electrically connected to the absorber structure, the test circuitry being configured to selectively apply an actuation voltage to the absorber structure, wherein the absorber structure is configured to flex toward the substrate under a test condition, wherein the second distance is selected such that the contact portion of the pillar structure is positioned in contact with the first electrode structure when the absorber structure is flexed in response to the test condition, wherein the test condition comprises an actuation voltage being applied to the first electrode structure, and wherein the second distance is selected such that the contact portion of the pillar structure is attracted to the first electrode structure by an electrostatic charge induced by the actuation voltage.
地址 Stuttgart DE