发明名称 |
Semiconductor memory device and method for manufacturing the same |
摘要 |
According to one embodiment, a semiconductor memory device includes a semiconductor substrate, a first insulating film provided on the semiconductor substrate, a silicon film provided on the first insulating film, a metal silicide film provided on the silicon film, a second insulating film provided on the metal silicide film, and an electrode provided on the second insulating film. |
申请公布号 |
US9129995(B2) |
申请公布日期 |
2015.09.08 |
申请号 |
US201314107492 |
申请日期 |
2013.12.16 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Nakajima Kazuaki;Murakoshi Atsushi |
分类号 |
H01L29/66;H01L21/28;H01L27/115;H01L29/788 |
主分类号 |
H01L29/66 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A semiconductor memory device comprising:
a semiconductor substrate; a first insulating film provided on the semiconductor substrate; a floating gate comprising, a silicon film provided on the first insulating film, and a metal silicide film provided on the silicon film, the metal silicide film including, an oxidized portion made of silicon oxide and having an inverted cup shape, and a metal silicide portion made of metal silicide being located inside the oxidized portion, said metal silicide portion having side surfaces circumferentially surrounded by the oxidized portion and a top surface covered by the oxidized portion; a second insulating film provided on the metal silicide film; and a control gate electrode provided on the second insulating film. |
地址 |
Minato-ku JP |