发明名称 Semiconductor memory device and method for manufacturing the same
摘要 According to one embodiment, a semiconductor memory device includes a semiconductor substrate, a first insulating film provided on the semiconductor substrate, a silicon film provided on the first insulating film, a metal silicide film provided on the silicon film, a second insulating film provided on the metal silicide film, and an electrode provided on the second insulating film.
申请公布号 US9129995(B2) 申请公布日期 2015.09.08
申请号 US201314107492 申请日期 2013.12.16
申请人 Kabushiki Kaisha Toshiba 发明人 Nakajima Kazuaki;Murakoshi Atsushi
分类号 H01L29/66;H01L21/28;H01L27/115;H01L29/788 主分类号 H01L29/66
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A semiconductor memory device comprising: a semiconductor substrate; a first insulating film provided on the semiconductor substrate; a floating gate comprising, a silicon film provided on the first insulating film, and a metal silicide film provided on the silicon film, the metal silicide film including, an oxidized portion made of silicon oxide and having an inverted cup shape, and a metal silicide portion made of metal silicide being located inside the oxidized portion, said metal silicide portion having side surfaces circumferentially surrounded by the oxidized portion and a top surface covered by the oxidized portion; a second insulating film provided on the metal silicide film; and a control gate electrode provided on the second insulating film.
地址 Minato-ku JP