Semiconductor flip-chip system having oblong connectors and reduced trace pitches

摘要

A semiconductor chip (102) assembled on a substrate (101). The substrate has a first surface (101a) including conductive traces (110), which have a first length (111) and a first width (112), the first width being uniform along the first length, and further a pitch (114) to respective adjacent traces. The semiconductor chip has a second surface (102a) including contact pads (121); the second surface faces the first surface spaced apart by a gap (130). A conductive pillar (140) contacts each contact pad; the pillar includes a metal core (141) and a solder body (142), which connects the core to the respective trace across the gap. The pillar core (141) has an oblong cross section of a second width (151) and a second length (152) greater than the second width. Trace pitch (141) is equal to or smaller than twice the second width (151). The trace pitch is equal to or smaller than the second length (152).

主权项

1. An apparatus comprising:
a substrate having a first surface including conductive traces, the traces having a first length and a first width, the first width being uniform along the first length, and further a pitch to respective adjacent traces; a semiconductor chip having a second surface including contact pads, the second surface facing the first surface spaced apart by a gap; a conductive pillar of a height on each contact pad, the pillar including a non-solder metal core and a solder body connecting the core to the respective trace across the gap; the pillar core having an oblong cross section across and perpendicular to the height and parallel to the second surface; and the oblong cross section having a second width and a second length greater than the second width and greater than the first width.