Light-emitting diode chip

摘要

A light-emitting diode (LED) chip comprising a first semiconductor layer; an active layer disposed on said first semiconductor layer; a second semiconductor layer disposed on said active layer; metal layers which disposed on said second semiconductor layer and overlapped with each other indirectly, comprising a first metal layer which connected to a first electrode deposited on said first semiconductor, and a second metal layer which connected to a transparent conductive layer and a second electrode deposited on said second semiconductor layer; wherein said second metal layer deposited on said first metal layer which further connected to said first semiconductor layer through an indentation.

主权项

1. A light-emitting diode (LED) chip comprising:
a first semiconductor layer; an active layer disposed on said first semiconductor layer; a second semiconductor layer disposed on said active layer; at least one indentation disposed on said second semiconductor layer, said indentation comprising a bottom part extending downward to reach said first semiconductor layer and exposing said first semiconductor layer; and a plurality of metal layers which disposed on said second semiconductor layer, comprising a first metal layer which is connected to said first semiconductor layer through said bottom part, and a second metal layer which is connected to a transparent conductive layer deposited on said second semiconductor layer; wherein said second metal layer indirectly deposited on said first metal layer.